Flipchip工艺流程 PPT课件.pptVIP

Flipchip工艺流程 1.Metal bump 金属凸块-C4 process(IBM) 2. Tape-Automated bonding 卷带接合-ACF process 3. Anisotropic conductive adhesives 异方向性导电胶 -ACP process 4.Polymer bump 高分子凸块 - C4 process 5.Stud bump. 打线成球 - ACP process(Matsushita) Flip Chip conductive method - connect to Substrate/PCB C4: controlled collapse chip connection ACF: anisotropic conductive film ACP(ACA): anisotropic conductive Adhesive paste Kingbond Training Course Kingbond Training Course Various flip chip technologies PS: WIT ( Wire interconnect technology) TAB(Tape- automated bonding) Kingbond Training Course Various flip chip technologies Kingbond Training Course Stud Bump Flip Chip Bond Underfill Cure oven Cure oven SBB Process C4: Controlled Collapse Chip Connection Process Kingbond Training Course Reflow oven Flip chip bonder Flux cleaner Underfill dispenser Cure oven 1. Flux coating or re-printing 2. Mounting Heating Cleaning Dispensing Heating Wafer bump Bump by solder ACP: Anisotropic Conductive Paste Process Reflow oven Flip chip bonder Underfill dispenser Cure oven Thermosetting Dispensing Heating 1. Print the ACA 2. Alignment Wafer bump Bump by Ag Kingbond Training Course ACF: Anisotropic Conductive Film Process ACF Pre-setter Flip chip bonder Press and cure equipment ACF Pre-setting 1. Mounting 2.Heating 3.Press 1.Heating 2.Press Wafer bump Bump by Au Kingbond Training Course Overcoat with polymide and open the bump areas.Pattern wettable base metal Coat chip with polymide, open vias over each pad Used dry-film lift-off process to define base metal and solder on each pad Pattern aluminum to re-route I/O to on area array Conventional chip with aluminum I/O pads around the perimeter Tack,Flux Reflow Print,Place Reflow Kingbond Training Course FCT Bump Structure Silicon wafer UBM-Under Bump Metallurgy Solder Bump Final Metal Pad Die Passivation Wafer Bump Kingbond Training Course 1. 蒸镀 Evaporation 2. 溅镀 Sputter 3. 电镀 Electroplating 4. 印刷 Printed solder paste bump 5. 锡球焊接 Solder b