键合剪切测试.docx

AEC-Q100-001 AEC-Q100-001 - REV-C AEC-Q100-001 AEC-Q100-001 - REV-C Automotive Electronics Council Component Technical Committee 汽车电子理事会 元器件技术委员会 AEC-Q100-001 REV-CWIRE BOND SHEAR TEST AEC-Q100-001-REV-C 键合剪切测试 AEC-Q100-001 -REV-C Automotive Electronics Council Component Technical Committee Change Notification （变更通知） The following summary details the changes incorporated into AEC-Q100-001 Rev-C: 版本C有下面的变更内容： Section 1.3.4.4, Type 4 ? Die Surface Contact: Corrected wording to reflect bond shear type where the shear tool contacts the die surface, rather than the bonding surface as stated in Rev - B. 第1.3.4.4部分的类型4.芯片表面接触：纠正剪切类型的用语，与剪切工具接触的是芯片表面，而不是B版所说的 焊接表面 Added new Section 1.3.5, Footprint: Added new definition for “footprint; changed numbers of subsequent sections to reflect the addition. 増加新条款1?3.5,接触面积（脚印）：増加“接触面积”的新定义，并改变了其后部分的顺序号。 Section 3.6 step b, Footprinl Inspection of Aluminum Wedge/Stitch Bonds: Added wording to clarify method used to remove wire for footprint inspection. 第3.6,步骤B,铝锲焊/钾焊的接触面积检验：增加用语说明检验接触面枳时去除键合丝的方法。 Figure 3, Wire Bond Shear Types: Updated figure to reflect wording correction made to Type 4 - Die Surface Contact. 图例3,剪切型式：更新图例，纠正类型4?芯片表面接触的用语 Minor wording changes were made to the following: Section 1.1,1.3.1,1.3.4.1,1.3.4.5, 2.2, 2.5, 3.2, and 3.5. ^1.1,1.3.1,1.3.4.1,1.3.4.5, 2.2, 2.5, 3.2,和 3.5部分有些用语稍作更改。 AEC ? Q100-001 AEC ? Q100-001 - REV-C AEC ? Q100-001 AEC ? Q100-001 - REV-C Automotive Electronics Council Component Technical Committee METHOD - 001 方法?001 WIRE BOND SHEAR TEST键合剪切测试 Text enhancements and differences made since the last revision of this document are shown as underlined areas. Several figures have also been revised, but changes to these areas have not been underlined. 本文件的最新修改版本所作出的文本升级和与前版的不同之处，均已用下划线友示。?些图例也做了修改， 但此修改未曾用下划线标记出来。 1. SCOPE 范围 Description 描述 This test establishes a procedure for determining the strength of the interface between a gold ball bond and a package bonding surface, or an aluminum wedge