制造工程简要训练.pptxVIP

;題綱 (Chapter) 頁次(Page);第 1章 IC 元件外形及重要尺寸規格;Surface Mounted Package;1-2. 208P QFP 重要尺寸規格介紹 ( Mechanical Specifications) ：;The Important Specifications for QFP : 1. Lead Co-planarity : USL : 4.0 mils. 2. Lead Span : USL : 6.5 mils. 3. Bent Lead : USL : +3 mils, LSL : -3 mils. 4. QFP Package warpage : USL : 4 mils. 5. LQFP Package warpage : USL : 3 mils. Note (1) USL : Upper Spec. Limit. (2) LSL : Lower Spec. Limit. (3) 1mil = 0.0254mm.; 1-3. 476P BGA 重要尺寸規格介紹(Mechanical Specifications) :;The Important Specifications for BGA : 1. Solder Ball Co-planarity :