中镀科技-PC-600 脉冲镀铜 张17751262980.docxVIP

PC-600 ACID COPPER PLATING PROCESS PC-600 ACID COPPER PULSE PLATING PROCESS DESCRIPTION PC-600 is an acid copper plating additive system that has been specifically optimized for use with pulse periodic reverse rectification on a continual production basis. READ ENTIRE TECHNICAL DATA SHEET BEFORE USING THIS PRODUCT FEATURES BENEFITS The process produces a fine-grained, ductile deposit with excellent distribution characteristics, and is maintained with two components. The combination of PC-600 and a periodic reverse pulse plating rectifier can significantly shorten plating times while maintaining excellent distribution ratios. PHYSICAL PROPERTIES Nominal Deposit Characteristics Electrical Resistivity 1.68 micro-ohm-cm Elongation* Greater than 18% Internal Stress 750 to 1500 psi Density 9 g/cc Ultimate Tensile Strength* Greater than 36,000 psi Solderability Excellent Microscopic Structure Fine Grained Equiaxed PROCESS COMPONENTS REQUIRED Product Name PC-600 Carrier PC-600 Replenisher EQUIPMENT Tanks, pipes, fittings and valves should be acid resistant. All plastic parts should be of Teflon?, PVC, PVDF, polypropylene or high-density polyethylene construction. Soft PVC (e.g. Tygon?) is not recommended for constant contact with the bath. Anode bars, cathode bars and bus bars should be made of copper. Bolts, fixtures, etc. that are not immersed in the plating solution may be made of copper, bronze, 316 stainless steel or titanium. Metal parts that will be immersed in the plating bath should be constructed of titanium. Acid copper sulfate solutions are corrosive. It is important to protect the floors, plumbing and any other equipment, which may come in contact with the plating solution. Vinyl coatings, asphalt or several coats of rubber-based paint will usually provide adequate protection. Rectifier output (amperage) should be calibrated to ± 5% or less across the working range. Also the pulse wave form (especially the % overshoot and rise time) should be checked with an o