PCB设计及制造术语大全(中英文对照).pdf

线路板流程术语中英文对照

流程简介：开料－－钻孔－－干膜制程－－压合－－减铜－－电镀－－塞孔－－防焊(绿漆/绿油)

－－镀金－－喷锡－－成型－－开短路测试－－终检－－雷射钻孔

a.开料(cutlamination)

a-1裁板(sheetscutting)

a-2原物料发料(panel)(shearmaterialtosize)

b.钻孔(drilling)

b-1内钻(innerlayerdrilling)

b-2一次孔(outerlayerdrilling)

b-3二次孔(2nddrilling)

b-4雷射钻孔(laserdrilling)(laserablation)

b-5盲(埋)孔钻孔(blindburiedholedrilling)

c.干膜制程(photoprocess(d/f))

c-1前处理(pretreatment)

c-2压膜(dryfilmlamination)

c-3曝光(exposure)

c-4显影(developing)

c-5蚀铜(etching)

c-6去膜(stripping)

c-7初检(touch-up)

c-8化学前处理,化学研磨(chemicalmilling)

c-9选择性浸金压膜(selectivegolddryfilmlamination)

c-10显影(developing)

c-11去膜(stripping)

developing,etchingstripping(des)

d.压合lamination

d-1黑化(blackoxidetreatment)

d-2微蚀(microetching)

d-3铆钉组合(eyelet)

d-4叠板(layup)

d-5压合(lamination)

d-6后处理(posttreatment)

d-7黑氧化(blackoxideremoval)

d-8铣靶(spotface)

d-9去溢胶(resinflushremoval)

e.减铜(copperreduction)

e-1薄化铜(copperreduction)

f.电镀(horizontalelectrolyticplating)

f-1水平电镀(horizontalelectro-plating)(panelplating)

f-2锡铅电镀(tin-leadplating)(patternplating)

f-3低于1mil(lessthan1milthickness)

f-4高于1mil(morethan1milthickness)

f-5砂带研磨(beltsanding)

f-6剥锡铅(tin-leadstripping)

f-7微切片(microsection)

g.塞孔(plughole)

g-1印刷(inkprint)

g-2预烤(precure)

g-3表面刷磨(scrub)

g-4后烘烤(postcure)

h.防焊(绿漆/绿油):(soldermask)

h-1c面印刷(printingtopside)

h-2s面印刷(printingbottomside)

h-3静电喷涂(spraycoating)

h-4前处理(pretreatment)

h-5预烤(precure)

h-6曝光(exposure)

h-7显影(develop)

h-8后烘烤(postcure)

h-9uv烘烤(uvcure)

h-10文字印刷(printingoflegend)

h-11喷砂(pumice)(wetblasting)

h-12印可剥离防焊(peelablesoldermask)

i.镀金goldplating

i-1金手指镀镍金(goldfinger)

i-2电镀软金(softni/auplating)

i-3浸镍金(immersionni/au)(electrolessni/au)

j.喷锡(hotairsolderleveling)