BCM4330 WLAN设计与高亮特性概述.pdfVIP

4330WLAN设计

24/Mar/2011

BCM4330特性

•单集成

•802.11a/b/g

•单流802.11n蓝牙

4.0FM/接收

片上功率放大器

2.4GHz

•5GHz

•主机接口

SDIO‑SPIHISC（短距

离USB）

封装

FCBGA‑

WLBGA

WLCSP

4330WLANDesign

24/Mar/2011

BCM4330Highlight

•Singlechipwithintegrationof

•802.11a/b/g

•Singlestream802.11n

Bluetooth4.0

FMTx/Rx

•On-chipinternalpoweramplifier

•2.4GHz

•5GHz

•Hostinterface

SDIO

-SPI

HISC(shortdistanceUSB)

Package

FCBGA

-WLBGA

WLCSP

-模块描述

Broadcom专有和。©2009BroadcomCorporation。。

4

Bcm94330wlsdagb133‑WLBGA参考板

顶层

-Blockdescription

BroadcomProprietary.©2009BroadcomCorporation.Allrights

.

4

Bcm94330wlsdagb133-WLBGARefBoard

•Toplayer

Bcm94330wlsdagb133‑WLBGA参考板

第二层

Bcm94330wlsdagb133-WLBGARefBoard

2ndlayer

Broadcom。©2009BroadcomCorporation。。

6

BroadcomProprietary.©2009BroadcomCorporation.Allrights

.

6

RF前端

•将射频线保持在同一层的组件侧，以避免在射频线上使用过孔。

在射频线周围添加接地缝，并确保其阻抗为50欧姆。

•为每条射频走线足够的/间距。

Broadcom专有和。©2009BroadcomCorporation。。

9

RFFront-End

•KeepRFlinesonthesamelayeronthecomponentsidetoavoidusingviasonRF

lines.

•AddGNDstitchesaroundRFlinesandensurethatit’s50ohmimpedance.

•Provideadequateisolation/spacingoneachRFtrace.

BroadcomProprietary.©2009BroadcomCorporation.Allrights

.

9

VBAT/CBUCK

•将C3靠近K11/K12/L12引脚放置