QFP封装元器件抗振性能分析及加固.pdfVIP

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QFP封装元器件抗振性能分析及加固

杨龙，醋强一，刘冰野，齐文亮

（西安航空计算技术研究所，西安710068）

摘要：

QFP封装的元器件被广泛的应用于机载电子设备中，而元器件手册中并不提供其能够承受的振动量值。文中以第

四强度理论及米勒损伤累积理论为基础，以管腿材料的物理特性为判据，对元器件抗振性能进行分析。在寿命余量较小的

情况下，采取加固方案并进行了热疲劳分析和振动强度分析，提高元器件的使用寿命。

关键词：

QFP；抗振性能；加固；机载电子设备

中图分类号:TN602文献标志码:粤文章编号：员园园圆原圆猿猿猿（圆园21）08原园033原园3

AnalysisandReinforcementofAnti-vibrationPerformanceofQFPPackagedComponents

YANGLong,CUQiangyi,LIUBingye,QIWenliang

(AeronauticalComputingTechniqueResearchInstitute,Xi’an710068,China)

Abstract:QFPpackagedcomponentsarewidelyusedintheairborneelectronicequipment,andthecomponentmanual

doesnotprovidetheamountofvibrationthatitcanwithstand.BasedonthefourthstrengththeoryandMillerdamage

accumulationtheory,thispaperanalyzestheanti-vibrationperformanceofcomponentsbasedonthephysical

characteristicsofthetubelegmaterial.Inthecaseofasmalllifemargin,areinforcementplanisadopted,andthermal

fatigueanalysisandvibrationstrengthanalysisarecarriedouttoimprovetheservicelifeofcomponents.

Keywords:QFP;vibrationresistance;reinforcement;airborneelectronicequipment

[1]

0引言动，无法进行比较和参考。但对于QFP封装