PCBA制程工程技术概论与基础_(PE+EE).ppt

Post Reflow Process回流焊 In the soldering process, three different heating methods are used 三种不同的加热模式用在焊接制程中。 Conduction热传导 Convention热对流 Infrared Radiation (IR)红外辐射 ? Different heat transfer methods offer different advantages and disadvantages 不同的热传输模式有不同的优势和劣势 Conduction热传导 Conduction occurs when two solid masses of different temperatures are in contact with each other热传导发生在不同温度下的两个固体相互的接触 ? Provides uniform product heating as heat will conduct from a hot spot to a cold spot in the product供给均匀的热，由于热能将从热的一端传到冷的一端。 Post Reflow Process回流焊 Convection --热对流 Convection heat transfer occurs when a fluid (such as air or nitrogen) flows over the object to be heated热对流发生在气体吹过目标物（如空气或氮气）。 Two types -Natural Convection and Forced Convection两种方式- 自然对流和强制性对流 ?Natural convection occurs when no flow is being forced over the object自然对流发生于没有气体被强制流过目标物。 Forced convection requires an external force that pushes or pulls the flow over the object强制对流需要一种外部的压力推动或拉动气流流过目标物。 Most soldering ovens today use forced convection as the primary heat transfer method今天大多数焊接烤箱使用强制对流作为换热模式预热的主要方法 Post Reflow Process回流焊 Infrared Radiation (IR)红外辐射 Infrared radiation (IR) occurs when two bodies of different temperatures are in sight of each other红外辐射发生与当两种不同温度的物体在相互的视野内 Heat is transferred by the electromagnetic waves generated by the hot body热被产生于热物体的电磁波转换。 Two important phenomenon with radiation:两种重要的辐射现象 Absorbtivity : Percentage of infrared absorbed by the PCB and components吸收：被PCB 和元件吸收的百分比 ? Black Body : A body that absorbs all radiation incident upon its surface黑体：吸收所有表面辐射的物体 Post Reflow Process回流焊 Post Reflow Process回流焊 Soldering Surface Mount Components表面粘贴元件 焊接 回流焊 波峰焊 蒸气 红外辐射 强制对流 All the soldered connects Are created in a single step 所有的焊接在一个步骤完成 The soldered connections are Created one after another 焊接在一个步骤接着另一个步骤地完成 Soldering Through Hole Components 插件元件 Post Reflow Process回流焊 插件元件 一次性的 连续性的 Pos