组元选择及基片转速对磁控溅射金属复合膜层结构的影响马续航.pdfVIP

Vol. 5 No.8/ Aug. 2011 Effects of Components Substrate Rotation on Multi-Layer Nanostructure of Two-Component Thin Films Prepared by Magnetron Sputtering 以Cr、Cu、Al纯金属和石墨作为靶材，采用多靶磁控溅射方法制备3种二元镀层，通过XRD和TEM确定镀层物相及 结构特征，实验研究了组元选择与基片转速对镀层中纳米多层结构形成的影响。结果显示：Cr-C镀层由晶态Cr和非晶C组 成，基片转速由2 r/min提高到5 r/min时，镀层均显示Cr层和C层交替分布的周期性多层结构，其层间距则由约8nm降至 5nm；Cu-Al镀层的物相则以Al Cu 相为主，2 r/min时还伴有少量AlCu相生成，不同转速下获得的Cu-Al镀层均显示均一 4 9 的柱状生长结构，未形成Cu/Al相交替的纳米多层结构；Cr-Cu镀层由Cr的晶态相和Cu的晶态相组成，基片转速由2 r/min 提高到5 r/min时，镀层沉积特征由层间距约55 nm的Cr、Cu两相交替多层结构转为直径约10 nm的Cu微晶弥散分布于Cr 相基体的结构，同时Cu、Cr两相的择优取向也发生改变。上述规律表明，采用纯组元靶材溅射制备二元复合镀层时，镀层 的物相成分主要取决于靶材组元的选择，而基片转速的变化则显著影响镀层的沉积结构特征，二元复合镀层中纳米多层结 构的形成与基片周期性通过不同组元的主沉积区域直接相关，同时组元比例、组元间的扩散以及化合物相的形成等诸多因 素均可能阻止这种纳米多层结构的形成。 磁控溅射；二元复合镀层；纳米多层结构；基片转速 ABSTRACT Three kinds of two-component films are deposited on (111) silicon chips by multi-target magnetron sputtering process, in which targets made of pure Cr, Cu, Al, and graphite are selected as binary sputtering sources. The effects of components and substrate rotation on the formation of multi-layer nanostructures of the fi lms are experimentally investigated by XRD-analyzed phase composition and TEM-observed structures of obtained films. The results show that, the Cr-C fi lms are composed of Cr crystalline and amorphous Carbon. When the rotating speed increases from 2 r/min to 5 r/min, similar multi-layer structures that are periodically overlapped by individual Cr layers and amorphous C layers are acquired. However, the interval of overlapped Cr/C layers decreases from 8nm to 5nm approximately. In the case of prepared Cu-Al fi lms, the fi lms are mainly composed of Al Cu intermetallic phase, despite a small amount of