BGA底部承垫坑裂改善探讨.pdfVIP

201 and 4秋季国I碌PCB技术／信息论坛 产品检测与可靠性Inspection BGA底部承垫坑裂改善探讨 Code：A-014 Paper 孟昭光冉彦祥 (东莞市五株电子科技有限公司，广东东莞523290) 摘要 随着手机线路板日趋精密，BGA球形矩阵设计越来越小，随之引发一系列品质风险， 如焊点脱离、连锡、BGA底部开裂等。其中BGA底部开裂问题涉及PCB布线设计、PCB材 料及加工工艺、SMT焊接工艺、BGA芯片等多个领域，导致问题长期得不到有效的解 决。本文通过一个失效案例解析展开，从Pc啵计选材及加工工艺方面做些简单原因 探讨分析及改善措施，想必对BGA底部承垫BGA坑裂品质改善方面有一定帮助 关键词 坑裂；铜芽；球栅阵列开窗；剥离强度；成品铜厚；BGA负蚀常 中图分类号：TN41文献标识码：A BGAcrack atthe improvebearingpad bottomofthe discussion pit MENG RAN Zhao-guangYan-xiang Abstract withthe mobile circuit ball phone board，BGA Along increasinglysophisticated assolder at bottom ismoreandmore aseriesof the ofthe small，then risk，such out，even tin，BGA design quality in BGA atthebottomistheissuesinvolvedPCB and Layout，material cracking，etc．Thecracking processing for other it failto solvethe PCB，SMT fields，and technology weldingtechnology,BGAchip，and easily effectively this afailurecase dosome PCB and analysis，we design problem．Inarticle，through