溶胶_凝胶法制备二氧化硅微球研究进展概述_郭倩.pdfVIP

- 1 518055 2 999077 - - O 613.72 A Review of Research Progress in Preparation of Sphere Silica Particles by Sol-Gel GUO Qian1 ZHU Pengli1 SUN Rong1 WONG Chingping2 1( Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China ) 2( Department of Electronic Engineering, Faculty of Engineering, the Chinese University of Hong Kong, Hong Kong 999077, China ) Abstract With the characteristic of low coeffi cient of thermal expansion, high heat resistance, high wet resistance and low dielectric constants, silica could effectively reduce the coeffi cient of thermal expansion, water absorption, contraction ratio and inner stress of epoxy resin. So, silica has been widely used in the fi eld of electronic packaging. The Sol-Gel methods developed in recent years for preparation of silica spheres, the process factors, and the study of being fi lled with epoxy resin were reviewed in this article. And the problems and development direction of silica applied in the fi eld of electronic packaging were pointed out as well. Keywords spheresilica particles; sol-gel; epoxy composites; electronic packaging 1 2014-07-26 2014-11-12 2011D052KYPT20