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Hong Xiao, Ph. D. www2.austin.cc.tx.us/HongXiao/Book.htm Introduction to Semiconductor Manufacturing TechnologyChapter 1, Introduction Topics Introduction IC Device and Design Semiconductor Manufacturing Processes Future Trends Introduction First Transistor, ATT Bell Labs, 1947 First Single Crystal Germanium, 1952 First Single Crystal Silicon, 1954 First IC device, TI, 1958 First IC product, Fairchild Camera, 1961 First Transistor, Bell Lab, 1947 First Transistor and Its Inventors First IC Device Made by Jack Kilby of Texas Instrument in 1958 First Silicon IC Chip Made by Robert Noyce of Fairchild Camera in 1961 Moore’s Law Moore’s Law, Intel’s Version IC Scales Road Map Semiconductor Industry Feature Size and Wafer Size Smallest Known Transistor Made by NEC in 1997 Limit of the IC Geometry Limit of the IC device Atom size: several ? Need some atoms to form a device Likely the final limit is around 100 ? or 0.01 micron. About 30 silicon atoms IC Design: First IC IC Design:CMOS Inverter A Mask and a Reticle Wafer Process Flow 材料科學與工程學系 義守大學 – 助理教授 劉文仁 Photo courtesy: ATT Archive John Bardeen, William Shockley and Walter Brattain Photo courtesy: Lucent Technologies Inc. Photo courtesy: Texas Instruments Photo courtesy: Fairchild Semiconductor International Intel co-founder Gorden Moore notice in 1964 Number of transistors doubled every 12 months while price unchanged Slowed down in the 1980s to every 18 months Amazingly still correct, likely to keep until 2010. Transistors 10K 100K 1M 10M 1975 1980 1985 1990 1995 4040 8080 8086 80286 80386 80486 Pentium Pentium III 1K 2000 Integration level Abbreviation Number of devices on a chip Small Scale Integration SSI 2 to 50 Medium Scale Integration MSI 50 to 5,000 Large Scale Integration LSI 5,000 to 100,000 Very Large Scale Integration VLSI 100,000 to 10,000,000 Ultra Large Scale Integration ULSI 10,000,000 to 1,000,000,000 Super Large Scale Integration SLSI over 1,000,000,000 1995 1997 1999 2001 2
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