WLAN芯片在Ultraflex平台上测试解决方案地研究.pdfVIP

Dissertation Submitted to Shanghai Jiao Tong University for the Degree of Master STUDY ON WLAN CHIP TEST SOLUTION ON THE ULTRAFLEX TESTER Candidate： Wenjun Song Student ID: 1082102031 Supervisor： Prof. Ma Jun Assistant Supervisor: Sr. Test Engineer Bu Tao Academic Degree Applied for ： Master of Engineering Speciality： Integrated Circuits Affiliation ： School of Microelectronics Date of Defence ： June 5th, 2010 Degree-Conferring-Institution ： Shanghai Jiao Tong University WLAN芯片在Ultraflex平台上测试解决方案研究 摘 要 随着无线通讯技术的普及和发展，无线通讯芯片的需求量正在不 断增长。与此同时，对于芯片的质量和成本的要求也在不断上升。因 此，对于WLAN芯片的测试方案不但需要保证基本的测试覆盖率，而 且更加需要减少测试成本来降低芯片的总成本。 本文通过在Ultraflex平台上对WLAN芯片的直流、交流、混合信号 和射频信号部分的完整测试来保证其达到基本的测试覆盖率，涵盖了 接触性测试、漏电测试、MBIST/SCAN/JTAG 、DAC/ADC测试以及射 频接收和发射器测试。总计包括九百余项子测试项目来确保芯片能够 正常进行无线通信并保持较低水平的动态和静态电流。与此同时，本 测试方案通过设计多工位(八个工位并行测试)测试板来降低测试成 本，并借由减少射频测试部分的测试频点选择来减少测试项目，从而 减少测试时间。最后，通过对先期量产数据的分析对测试解决方案进 行最后的修正并正式投入量产阶段。 关键词：WLAN芯片，Ultraflex平台，芯片测试，多工位 I STUDY ON WLAN CHIP TEST SOLUTION ON THE ULTRAFLEX TESTER ABSTRACT With the development and population of the wireless communication technology, wireless communication chip is in great demand and keeping growth. Meanwhile, the requirement on the quality and cost of the chip is stricter. Therefore, the WLAN chip test solution must no only ensure the basic coverage rate, but also reduce chip total cost by lower final test cost. Based on testing the DC, AC, mixed signal and RF part of the WLAN chip on Ultraflex tester, we confirm the test coverage rate of the chip, whic