(October2010)oftheKnowledgeMatrix-SAEInternational.xlsVIP

links def abbrev knowledge matrix Introduction - to guide PCB, BGA substrate design layout; Use of underfill- material properties of solder and UBM - control reflow temperature profile - PCB BGA substrate design layout rules (FEM simulation) - use of underfill - package and board warpage JESD22-B111 IPC / JC 9701 IPC / JC 9703 IPC / JC 9701 capacitor transistor array mobile ions GOX hard BD comments G short IG leak QBD, step V GOX soft BD charge loss contact spiking could result in hard break down barrier density local temperature increase etch performance failure increased leakage current Vth JESD90 JESD92 capacitor structures JESD87 HAST Contact array weak comp , spec violation use SOA results from simulator via-line resistance do FEM simulation Abbreviations TDDB TC TS HTOL Econst Eramp Vconst QBD HCS HTS HTB AC Temperature Cycling High Temperature Operating Life Test Constant Field Stress Ramped Field Stress Constant Voltage Stress Charge to Breakdown Hot Carrier Stress High Temperature Storage High Temperature Bias Autoclave (RH=100%, T=121°C) Time Dependant Dielectric Breakdown Material TVS Triangular Voltage Sweep no via resistance Via chain or Kelvin via structure redundant vias SiO2 JESD28 JESD60 SOG large area defect density structure PCM Ileak temp simulation High k dielectrics percolation model n.a. extrinsic PAT ECC SILC bit flip or retention fails Vth cell cell array Part Average Testing Stress induced leakage current Temperature Shock EM (constant current, constant temperature stress) VD/VG-stress drain or gate stress EM resistance increase V-stress, IDDQ program/erase cycling induced SILC charge detrapping poly Si NVM ONO NVM NROM charge detrapping Cu no generic model local temperature increase Al / Si w barrier Al-alloy w/o barrier Si Al diffusion (Arrhenius) DFMEA comb serpentine assembly/ package functional fail electrical test product leakage current PTC mechanical stress (compression) package CM PC product / daisy chain HTSL Arrhenius HTSL