全方位USBTypeCPresentation(产品简介)剖析.ppt

9.1 Simulation Model The model included short microstrip lines on both host PCB and device PCB. Rec. Side Plug Side 9.2 Proposed Pin-out P Connected to GND in HFSS REC. Side P P G T G P1 P2 DP1 P5 P6 DP3 P9 P10 DP5 T T T P3 P4 DP2 G G P7 P8 DP4 P P P11 P12 DP6 9.3 Impedance Profiles DP1/DP7 DP3/DP9 DP4/DP10 DP6/DP12 DP2/DP8 DP5/DP11 DP1 DP6 Rec. Side Plug Side 9.4 DDRL (Host Side) DP1/DP7 DP3/DP9 DP4/DP10 DP6/DP12 DP2/DP8 DP5/DP11 Informative requirements DP1 DP6 9.5 DDIL (Connector Only) DP1/DP7 DP3/DP9 DP4/DP10 DP6/DP12 DP2/DP8 DP5/DP11 DP1 DP6 Informative requirements 9.6 DDNEXT (SS+?SS+) DP1/DP7 DP3/DP9 DP4/DP10 DP6/DP12 DP2/DP8 DP5/DP11 DP3 to DP1 (Host Side) DP4 to DP1 (Host Side) DP9 to DP7 (Cable Side) DP10 to DP7 (Cable Side) Informative requirements 9.7 DDNEXT (SS+?D+/D-) DP1/DP7 DP3/DP9 DP4/DP10 DP6/DP12 DP2/DP8 DP5/DP11 DP2 to DP1 (Host Side) DP5 to DP1 (Host Side) DP5 to DP4 (Host Side) Informative requirements 9.8 DDFEXT (SS+?SS+) DP1/DP7 DP3/DP9 DP4/DP10 DP6/DP12 DP2/DP8 DP5/DP11 DP9 to DP1 (Cable-Host) DP10 to DP1 (Cable-Host) DP7 to DP3 (Host-Cable) DP7 to DP4 (Host-Cable) Informative requirements 9.9 DDFEXT (SS+?D+/D-) DP1/DP7 DP3/DP9 DP4/DP10 DP6/DP12 DP2/DP8 DP5/DP11 DP8 to DP1 (Cable-Host) DP11 to DP1 (Cable-Host) DP11 to DP4 (Cable-Host) Informative requirements Thank You 2 pairs at 10Gb/s for USB, 100 ohms? (AUX Config) * 2 pairs at 10Gb/s for USB, 100 ohms? (AUX Config) * 2 pairs at 10Gb/s for USB, 100 ohms? (AUX Config) * Foxconn’s design is compatible with docking (what about reverse docking (tablet with keyboard behind? – that would require a flippable connector) * 2 pairs at 10Gb/s for USB, 100 ohms? (AUX Config) * The molding condition is set as: Material : LCP E6808LHF Melt Temp :350℃ Mold Temp :100℃ Flow rate :20cm3/s Packing time :0.3s Packing pressure : 80% of max. injection pressure The mold flow meshes are shown as below: 241717 elements Gate 2. Receptacle Middle I/M model and molding conditions 20% 40% 60% 80% 95% As s