QT-00689Vr1.0 SMT回流传导焊接和胶固化设备的工艺控制要求.docVIP

三阶文件1.Product Revision 产品版本 Product Name产品名称 Applicable Product BOM Revision 适用的产品BOM版本 2.Change history更改记录 Updated Ver.最新版本 Effective date 生效日期 Prepared by起草人 Brief of Amendments 更改内容摘要 3.Purpose目的 The purpose of this document is to define the standard operation and process-monitoring procedures for reflow soldering, conductive soldering and adhesive curing equipment. 这份文件定义了回流焊接,传导焊接和胶固化设备的标准操作和制程监控程序. Scope范围 This procedure is applicable to Enics Suzhou facility that utilize the above-mentioned process. 这份文件适用于所有使用上述制程的生产工厂 5.Definitions定义 IPC-T-50 - Terms and Definitions for Interconnecting and Packaging Electronic Circuits. IPC-T-50 电子装联Responsibilities职责 SMT operators It is the responsibility of the SMT Operator to ensure the correct profile program is loaded. SMT作业员负责正确加载回流炉程序. SMT Technicians It is the responsibility of the technician to ensure that the profiles are available, and any new profiles are not saved as a Datapaq profile until they are within specification, and also be responsible for fabricating testing profile board, testing profile and printing the profile. SMT技术人员负责确保炉温曲线的有效性，保存符合规格要求的炉温曲线，并且负责制作炉温测试板，测试炉温并打印炉温曲线. SMT Line Supervisors It is the responsibility of the SMT Line Supervisors to ensure only trained operators are loading profiles into the machine. SMT线主管负责确保只有培训合格的作业员才能加载回流炉程序. SMT Engineer It is the responsibility of the SMT Engineer to indicate on any ECN, the requirement to re-profile an assembly, where the changes made could affect the thermal properties of that assembly and therefore the solderability of components, also be responsible for setting DataPaq software configure, temperature parameter and verify the profile testing result. SMT工程师负责指出任何的ECN，重测炉温的要求，哪些更改可能会影响产品的热性能和元件的可焊性，而且负责设置DataPaq软件配置，炉温参数和确认炉温曲线结果. QA technicains It is the responsibility of the QA technicians to verify whether on duty SMT technicians test