7传热模型.pptVIP

报告 – Heat Flux Heat flux 报告: 建议检查热平衡以确 保计算收敛 输出 Heat Flux 数据: 可以输出壁面的热通量数据 （包括辐射） file/export/custom-heat-flux 文件格式: zone-name nfaces x_f y_f z_f A Q T_w T_c HTC … 报告 – 传热系数 基于壁面函数的传热系数 其中 cP 为比热, kP 是点P处湍动能, T* 无量纲温度: 只有湍流并且能量方程开关打开时有用 The definition of E is E= h – pv + V^2/2 But pressure work and kinetic energy are not included by default for incompressible flows using segregated solver. As an example illustrating FLUENT’s capability to handle conjugate heat transfer problems, flow over an electronic chip mounted on a circuit board is presented. Here, the small box represents the chip, which contains a total energy source of 2 watts. The air heats as it flows over the chip, causing the chip to cool simulatneously. Heat transfer mechanisms considered in this simulation are: Heat conduction inside the chip Conduction from the chip to the wall Conduction along the length of the board Convection from the chip and board to the flowing air. The upper wall as well as the bottom surface of the circuit board are assumed to be externally cooled due to convection. The model is intended to be applicable to flow over an array of chips, so symmetry planes are employed on the sides of the computational domain. Taking further advantage of symmetry, only half of the chip is modeled. It is necessary to specify the energy source that will be applied to the chip. Opening the Solid panel from the Boundary Conditions specification panel and checking the source terms box enables specification of this term. Based on the half-volume of the chip, it has been determined that the total source term requirement is 904,050 watts per cubic meter. This is to say that if the chip had a volume of one cubic meter, it would dissipate a total of around 904,000 watts of thermal energy. For this model, we will assume this value to be constant. INCREASE VOLUME LEVEL!! Let’s take a look at the predicted temperature distribution inside the domain for