The impact of contact angle on flow resistance reduction in hydrophobic micro pin fins.pdfVIP

下载本文档

6
0
约6.29万字
约 15页
2017-03-16 发布于天津
举报
版权申诉

The impact of contact angle on flow resistance reduction in hydrophobic micro pin fins.pdf

1、本文档共15页，可阅读全部内容。
2、原创力文档（book118）网站文档一经付费（服务费），不意味着购买了该文档的版权，仅供个人/单位学习、研究之用，不得用于商业用途，未经授权，严禁复制、发行、汇编、翻译或者网络传播等，侵权必究。
3、本站所有内容均由合作方或网友上传，本站不对文档的完整性、权威性及其观点立场正确性做任何保证或承诺！文档内容仅供研究参考，付费前请自行鉴别。如您付费，意味着您自己接受本站规则且自行承担风险，本站不退款、不进行额外附加服务；查看《如何避免下载的几个坑》。如果您已付费下载过本站文档，您可以点击这里二次下载。
4、如文档侵犯商业秘密、侵犯著作权、侵犯人身权等，请点击“版权申诉”（推荐），也可以打举报电话：400-050-0827(电话支持时间：9:00-18:30)。
5、该文档为VIP文档，如果想要下载，成为VIP会员后，下载免费。
6、成为VIP后，下载本文档将扣除1次下载权益。下载后，不支持退款、换文档。如有疑问请联系我们。
7、成为VIP后，您将拥有八大权益，权益包括：VIP文档下载权益、阅读免打扰、文档格式转换、高级专利检索、专属身份标志、高级客服、多端互通、版权登记。
8、VIP文档为合作方或网友上传，每下载1次，网站将根据用户上传文档的质量评分、类型等，对文档贡献者给予高额补贴、流量扶持。如果你也想贡献VIP文档。上传文档

The impact of contact angle on flow resistance reduction in hydrophobic micro pin fins.pdf

Experimental Thermal and Fluid Science 77 (2016) 197–211 Contents lists available at ScienceDirect Experimental Thermal and Fluid Science journal homepage: /locate/etfs The impact of contact angle on ?ow resistance reduction in hydrophobic micro pin ?ns Ning Guan, Guilin Jiang, Zhigang Liu ?, Chengwu Zhang, Ning Ding Key Lab for Flow Enhanced Heat Transfer, Energy Research Institute of Shandong Academy of Sciences, Jinan 250014, Shandong, China article info Article history: Received 6 September 2015 Received in revised form 3 April 2016 Accepted 3 April 2016 Available online 9 April 2016 Keywords: Hydrophobic micro pin ?ns Flow resistance reduction Contact angles Reynolds number abstract The pressure drops and the friction factors are measured when ultra pure water ?ows through the elliptical, diamond and circular hydrophobic micro pin ?ns with different contact angles of h = 99.5°, 119.5° and 151.5°, and the coef?cients of pressure drop reduction dp_coe and friction factor reduction df_coe are calculated respectively. It is found that the value of dp_coe becomes large with the increase of h in elliptical and diamond micro pin ?ns, but for circular micro pin ?ns it increases at ?rst and then decreases. With the increase of h, both values of dp_coe and df_coe are reduced with the increase of the ?ow rate in elliptical micro pin ?ns, but the values are reduced at ?rst and then become almost constants in diamond and circular micro pin ?ns. Besides, the minimal value of df_coe is over 50% in diamond and circular micro pin ?ns with contact angle of h = 151.5°. When h P 119.5°, the values of dp_coe and df_coe in diamond and circular micro pin ?ns are both larger than those in elliptical test sections, but for h = 99.5° the former are slightly smaller than the latter at Re 600. ó 2016 Elsevier Inc. All rights reserved. 0. Introductions In recent decades, the Complementary Metal Oxide Semiconductor industries and other microelectronics industry have been developed rapidly