基于LTCC技术滤波器的优化设计稿毕业专业论文.docVIP

毕业论文 基于LTCC技术滤波器的优化设计 摘 要 随着无线通信的迅速发展，无线产品特别是射频、微波领域越来越需要高性能、高可靠性、低成本及良好的温度特性，小、轻、薄已经成为电子产品的发展趋势。这势必对IC集成及高密度封装技术提出更高的要求，传统的电路印刷(PCB)技术由于自身的特点大大限制了贴片分离元器件的小型化，LTCC技术作为一门新兴技术很好的解决了这个问题,另外鉴于滤波器在无线通信特别是在无线通信设备的射频前端占有重要的地位，本文就围绕着基于LTCC技术滤波器的优化设计展开，对LTCC技术相关内容加以分析和讨论。 本文第一部分首先就LTCC技术相对于传统的集成封装技术的优点、LTCC材料及基于LTCC技术产品的国内外发展现状及动态的介绍，以便于把握LTCC技术的发展动态；给出了LTCC技术工艺流程，并对每一工艺流程中的关键问题加以介绍；并对LTCC技术部分设计原则及应用软件加以介绍，以便为后面的三维电路建模提供了设计依据和设计手段。 本文第二部分首先通过对基于LTCC技术内埋置电感、电容三维建模及电磁场仿真得到几种常见电感、电容三维结构模型比较结果，从中得到：helical、VIC分别为LTCC内埋置电感、电容最佳模型选择；列举出影响内埋置电感、电容性能的各种因素，并给出结论分析及理论解释；得出修正T模型应用频宽远远大于传统的PI模型。第二部分的另外一个主要内容是LTCC滤波器优化设计，针对同一滤波器技术指标给出了两种结构：单零点和双零点。后者是在前者的基础上改进的。两种结构均可以满足给定的技术指标要求，后者在高频带外抑制要优于前者。 关键词：LTCC技术，阶跃阻抗谐振器，helical，滤波器 Abstract With the development of wireless communication, the latest wireless products demand ever-greater functionality, higher performance, and lower cost in smaller and lighter formats. That has been satisfied to date by major advances in integrated circuit (IC) and high-density packaging technologies, even though the RF sections have continued to demand high-performance and miniaturized passive components such as matching and filtering circuitry. Continuing reductions in size of discrete surface mounted components are having diminishing returns because of the incompatibility of the printed circuit board (PCB) technology, as well as the high cost of assembly of those tiny discrete components. And low temperature coffered ceramics (LTCC) can meet the demand very well. As we all know that the filter is very importance in the RF front-end of wireless communication. Then we study the filter basing on LTCC, and introduce the correlation of LTCC. The part one introduces the development actuality, trends and the technology of the low temperature cofired ceramics (LTCC) respectively, and introduces the techniques, the key issues and the design principle of LTCC circuits. and the design tools, such as Agilent ADS, Ansoft HFSS. The part two, at first giv