集成气象芯片中热应力对压力膜影响的有限元分析.pdfVIP

第19卷第5期 2006年10月 传感技术学报 CHINESE JOURNAL OF SENSORS AND ACTUATORS v01．19 No．5 0ct．2006 功e Influence of the功ermal Stress on a Pressure Sensor in Integrated Weather Multi-Sensor Chip YAO Su-yu，QIN Ming’，HUANGQing-an (Key Laboratory of MEMS of Ministry of Education，Southeast University，Nanjing 210096，Chim) Abstract：Layout design is quite important in multi-sensor integrated weather chips．The influence of the temperature field，induced by thermal anemometer，on pressure sensitive films is analyzed by FEA meth— od．The therma】stress distribution in the films iS simulated．Some parameters which affect th