等径角挤扭法制备SiCp／AI复合材料的界面特性.pdfVIP

学兔兔 第20卷第1期 粉末冶金材料科学与工程 2015年2月 Vb1．20 NO．1 Materials Science and Engineering of Powder Metallurgy Feb．2015 等径角挤扭法制备SiCp／AI复合材料的界面特性 钱陈豪，李 萍，薛克敏，董 飞，华 睿 (合肥工业大学 材料科学与工程学院，合肥 230009) 摘 要：以A1和SiC的混合粉末为原料，采用等径角挤扭工艺制备出含SiC颗粒(体积分数8．75％)的SiC。／Al复 合材料，并对其界面情况进行研究。采用x射线光电子能谱(xPs)对制备出的复合材料界面结合处的si和 A1元 素的价态进行测定，利用扫描电镜(SEM)~H场发射扫描电镜(FE—SEM)观察结合界面。结果表明，SiC的氧化层与 Al之间形成了冶金结合界面过渡层，材料界面处的显微硬度从1．73 GPa过渡到0．64 GPa，冶金结合界面使材料 表现出优良的耐蚀性，材料的压缩断口界面层为塑性断裂。 关键词：等径角挤扭法(ECAP．T)；SiC ／A1复合材料；界面；显微硬度；腐蚀形貌 中图分类号：TB331 文献标识码：A 文章编号：1673．0224(2015)1．65．07 Characteristics of SiCpi composites interface fabricated by equal channel angular pressing and torsion QIAN Chen—hao，LI Ping，XUE Ke—min，DONG Fei，HUA Rui (School ofMaterial Science and Engineering，Hefei University ofTechnolog~Hefei 230009，China) Abstract：Equal channel angular pressing and torsion(ECAP-T)was used to fabricate SiCp／A1 composite using the mixed powders of A1 and SiC．in which the volume fraction of SiC is 8．75％．The valence states of the element Si and A1 on the interface of the consolidated composite were detected by X—ray photoelectron spectroscopy rxPs)．The interface was characterized by scanning electron microscopy(SEM)and field emission—scanning electron microscopy(FE·SEM)． The results show that a kind of stable metallurgical interface forms between A1 and the oxide layer of SiC．This interface not only suppo~s the fine transition of micro—hardness between the reinforcement(1．73 GPa)and the matrix(0．64 GPa)， but also improves the co~osion resistance of the composite．And the interface also makes the compres