波峰焊过程中,十五种常见不良分析概要(国外英语资料).docVIP

波峰焊过程中,十五种常见不良分析概要 Wave soldering process, fifteen common bad analysis outline.Txt love is art, marriage is technology, divorce is arithmetic. This year the girls were vying for the small waist fine, who rare small belly Po? Higher than high salaries, paid as long, long as happy. Fifteen common adverse analysis procedures in wave soldering One, after welding, PCB board surface residue, multi board dirty: 1.FLUX solid content, not volatile too much. 2. before welding without preheating and preheating temperature is too low (dip, short time). The 3. approach is too fast (FLUX not fully volatile). 4. furnace temperature is not enough. Too much low impurity or tin tin in 5.. 6. added with anti oxidant or anti oxidant oil. 7. flux coating too much. Too much socket or open 8.PCB components, without preheating. The 9. element foot is out of proportion to the plate hole (Kong Taida) that causes the flux to rise. The 10.PCB itself is pre coated with rosin. 11. in the tin smelting process, FLUX wettability is too strong. 12.PCB process, a little hole, caused by the volatilization of FLUX is not smooth. 13. hand dip, PCB into the liquid, the angle is not correct. 14.FLUX used for a long time without adding thinner. Two, fire: 1. flux flash point is too low without flame retardant. 2. there is no wind knife, resulting in excessive coating amount of flux, preheating drops to the heating tube. The angle of the 3. air knife is incorrect (uneven coating of the flux on the PCB). Too much tape on the 4.PCB causes the bar to ignite. There is too much flux on the 5.PCB and drip it down to the heating tube. The 6. approach is too fast (FLUX not fully volatile, FLUX drop) or too slow (caused by surface temperature Too high). 7. preheat temperature too high. 8. process problems (PCB sheet is bad, heating tube is too close to PCB). Three, the corrosion (green components, black spot) One Copper and FLUX react chemically to form green copper compounds. Two Tin and FLUX chemical reaction, the