(PartⅡ)电子制造中的引线键合工艺(二) A Review on Wire Bonding Process in Electronic Manufacturing.pdfVIP

第13卷第2期 电　子　与　封　装 第 卷，第 期 电　子　与　封　装 总 第118期 13 2 Vo l . 1 3 ，N o . 2 ELECTRONICS PACKAGING 2013年2月 A Review on Wire Bonding Process in Electronic Manufacturing (Part Ⅱ) ZONG Fei, WANG Zhijie, XU Yanbo, YE Dehong, SHU Aipeng, CHEN Quan （Freescale Semiconductor (China) Limited , Tianjin 300385, China） Abstract: This paper attempted to integrate both reviewing on recent literatures and actual experiences in wire bonding process and provide a comprehensive review on bonding procedure, bonder motions, key bonding parameters, properties of bonding materials, designs of bonding tools as well as joining mechanism. At the same time some issues such as EFO-open, golf bond, short tail, non-stick on pad and lead were analysed; the solutions and recent developments to these issues were discussed. In addition, the application and special points of copper wire in wire bonding were also focused on. Because of the limitation of paper page, only key process factors were reviewed briefly; while this paper provided an opportunity to understand wire bonding well and brought a great benefit to the solving of whether actual operation issues or basic bonding principles. Key words: wire bond; procedure; parameter; capillary design; joining mechanism; bonding issue; copper CLC number: TN305.94 Document code: A Article ID: 1681-1070 （2013 ）02-0004-07 电子制造中的引线键合工艺（二） 宗　飞，王志杰，徐艳博，叶德洪，舒爱鹏，陈　泉 （飞思卡尔半导体（中国）有限公司，天津 300385 ） 摘　要：文章通过总结众多相关文献的研究成果和实际引线键合工艺中的经验心得，为读者呈现较 全面的有关于引线键合的介绍，包括键合时序、机台动作、关键键合参数、键合材料特性、键合工 具的设计、键合机理等方面。在对一些常见的工艺问题（如不烧球、高尔夫焊点、短线尾、焊点不