高频阶梯槽的制作研究_吴辉.pdfVIP

Special PCB 2013 No.4 The study on the high-frequency cavity WU Hui DONG Hao-bin LIU Pan Abstract As the development of the electronic products to the high frequency ,high speed and miniaturization.The desigh requirements of the high-frequency cavity is growing in intensity. This paper is based on the breakthrough of the problem that the high-frequency cavity produces high-frequency cavity misregistation, Squeeze-out of adhesive of coverlay and board damage at the normal processing technology,and studies on the realizability design of the high-frequency cavity. Key words High-Frequency Materials; Squeeze-out of Adhesive of Coverlay; Misregistation; Laser Ablation Low-flow+ PCB RF PCB Low-flow PP