electrochemical fabrication of shape-controlled copper hierarchical structures assisted by surfactants电化学加工的shape-controlled铜由表面活性剂辅助层次结构.pdfVIP

Hindawi Publishing Corporation Journal of Nanomaterials Volume 2012, Article ID 901842, 6 pages doi:10.1155/2012/901842 Research Article Electrochemical Fabrication of Shape-Controlled Copper Hierarchical Structures Assisted by Surfactants Huaping Dong,1 Yajun Wang,2 Feifei Tao,1 and Linxia Wang1 1 Department of Chemistry and Chemical Engineering, Shaoxing University, Shaoxing, Zhejiang 312000, China 2 College of Biological and Environmental Engineering, Zhejiang University of Technology, Zhejiang 310014, China Correspondence should be addressed to Feifei Tao, fingal.tao@ Received 1 August 2011; Accepted 21 September 2011 Academic Editor: William W. Yu Copyright © 2012 Huaping Dong et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. Various copper hierarchical structures assisted by surfactants were successfully fabricated combined with the electrodeposition technique. To the best of our knowledge, it is the first report on the controlled synthesis of metal copper hierarchical structures. All of the products synthesized in the presence and absence of surfactants, such as cetyltrimethylammonium bromide (CTAB), sodium dodecyl sulfate (SDS), or polyvinylpyrrolidone (PVP), were face-centered cubic copper, characterized by X-ray diffraction (XRD), indicating the surfactant-independent crystal structure. However, supplementing surfactants is helpful to construct hierarchical structures and exerts an important influence on copper morphologies. The absence of surfactants led to the formation of the nubby structures, while the use of surfactants resulted in the synthesis of the flower, dendrite, and sphere-like hierarchical morp