装型封装（Package）.docVIP

装型封装（Package） Series diode: SOD-23 123323523363, DO-214, DO-41, DO-35 package, switch tube, voltage regulator tube, Rectifier, Schottky, fast recovery diode, light emitting diode. Series transistors: SOT-23, SOT-,, TO-92, SOT-89, SOT-252, SOT-223, TO-220, TO-126 packages 1, BGA (ball, grid, array) Ball contact display, one of surface mount packages. A spherical bump is formed on the back of the printed substrate to replace the pin, and a LSI chip is mounted on the face of the printed substrate, and then sealed with a molding resin or potting method. Also called convex point display vector (PAC). The pin can be more than 200 and is a package used in multi pin LSI. The package body can also be smaller than the QFP (four side pin flat package). For example, the 360 pin BGA from the pin center to 1.5mm is only 31mm square, while the pin center is 304 QFP from the 0.5mm pin to 40mm square. And BGA doesnt have to worry about pin deformations like QFP. The package was developed by Motorola, Inc., which was first introduced in portable phones and other devices, and will be available in the United States in the future It may be popular in personal computers. Initially, the BGA pin (Bump) center distance is 1.5mm, and the pin number is 225. There are also some LSI manufacturers that are developing 500 pin BGA. The problem with BGA is the appearance check after reflow. It is not clear whether an effective visual inspection method is available. Some believe that because of the greater central distance of the weld, the connection can be considered stable and can only be handled by functional inspection. Motorola Corporation in the United States called encapsulated OMPAC sealed with molded resin, and sealed encapsulation of potting methods known as GPAC (see OMPAC and GPAC). 2, BQFP (Quad, flat, package, with, bumper) Four side pin flat package with cushion. One of the QFP packages is provided with a protrusion (cushion) in the four corners of the package body so as to prevent th