无铅微焊点焊接残余应力仿真分析.pdfVIP

摘 要 快速发展的微电子产业，使得焊点几何尺寸由毫米级缩小到微米级，电子组装也正 朝着高密度和高可靠性的方向发展。但是各芯片和基板在经过回流焊后，各个芯片、焊 点与基板的热膨胀系数不同，由于热膨胀系数的不匹配会导致各个零件之间产生约束， 相互制约，不能自由的伸缩，各零件就会产生不同的热应力，这些热应力可能会导致焊 点的失效，所以残余应力的分析是提高焊点可靠性的基础。 本文利用ANSYS有限元分析软件对QFP芯片与电路板在回流焊后焊点在残余应力方 面进行了研究。首先通过ANSYS分析软件的热应力线性耦合原理，计算出焊点的最大应 力，然后研究焊点高度、引脚间距、对流系数、冷却时间这四个因素对无铅焊接焊点应力 的影响，通过建立四因素四水平的正交表，求出各试验的最大应力，利用极差分析的方 法，得出各因素对回流焊残余应力的影响程度和影响顺序。分析所得到的结果为QFP芯 片与电路板在回流焊后焊点残余应力方面提供了理 依据，也为在无铅焊接的工艺参数 选择方面提供理 指导，具有一定的工程应用价值。 关键词：回流焊；无铅焊接；残余应力；仿真分析 simulation analysis of micro lead-free solder welding residual stress Student:XUE Bo-Zhou Teacher:Chen Xiao-yong、DAI Xuan-jun Abstract ：The rapid development of the microelectronics industry, so that the solder joint geometry millimeter down to the micron level, the electronics assembly is also moving in the direction of high density and high reliability development. However, in each chip and the substrate after reflow, each chip, a thermal expansion coefficient different from the substrate pads, because of the mismatch in thermal expansion coefficient between the various constraints can result in part, mutual restraint, not free to stretch, the parts will produce different thermal stresses, these thermal stresses can lead to failure of solder joints, so the residual stress analysis is to improve the basic solder Joint Reliability. This paper, by using ANSYS finite element analysis software of QFP chips and circuit board after reflow solder joints in the aspect of residual stress were studied. Firstly,using thermal stress linear coupling principle of ANSYS analysis software to calculate the maximum stress of solder joints ，then study the effect of lead-free solder joints stress by Joint height, pitch, convection coefficient, cooling time,through the establishment of the four factors and four levels orthogonal table, find the maximum stress of each test,the use of poor analysis, obtained the degre