Package Terminology封装术语.docVIP

Package Terminology BGABall Grid Array CBGACeramic Ball Grid Array CDIPGlass-Sealed Ceramic Dual In-Line Package CDIP SBSide-Braze Ceramic Dual In-Line Package CFPBoth Formed and Unformed CFP CPGACeramic Pin Grid Array CZIPCeramic Zig-Zag Package DescriptionDescription of package type. DFPDual Flat Package FC/CSPFlip Chip / Chip Scale Package HLQFPThermally Enhanced Low Profile QFP HQFPThermally Enhanced Quad Flat Package HSOPThermally Enhanced Small-Outline Package HTQFPThermally Enhanced Thin Quad Flat Pack HTSSOPThermally Enhanced Thin Shrink Small-Outline Package HVQFPThermally Enhanced Very Thin Quad Flat Package JEDECThe JEDEC Standard for this package type. JLCCJ-Leaded Ceramic or Metal Chip Carrier LCCCLeadless Ceramic Chip Carrier LengthThe length of the device (in millimeters). LGALand Grid Array LQFPLow Profile Quad Flat Pack Maximum HeightThe maximum height above board surface form (in millimeters). PDIPPlastic Dual-In-Line Package PFMPlastic Flange Mount Package Pkg Package designator code used in Texas Instruments part numbers. The link from the Pkg code goes to the package mechanical drawing in PDF format. Each of the PDF files is between 30K and 50K Bytes. PinsThe number of pins or terminals on the package. PitchThe distance between the centers of adjacent pins (in millimeters). Preference Code P - Use this package whenever possible OK - Use if a preferred package is not available A - Department approval required X - Do not use QFPQuad Flat Package SIPSingle-In-Line Package SOJJ-Leaded Small-Outline Package SOPSmall-Outline Package (Japan) SSOPShrink Small-Outline Package TFPTriple Flat Pack TO/SOTCylindrical Package TQFPThin Quad Flat Package TSSOPThin Shrink Small-Outline Package TVFLGAThin Very-Fine Land Grid Array TVSOPVery Thin Small-Outline Package ThicknessThe maximum thickness of the package body (in millimeters). TypeThe abbreviated acronymn for this type of