焊膏点涂工艺技术研究.pdfVIP

第33 卷 第11期 电 子 元 件 与 材 料 Vol.33 No. 11 20 14 年11 月 ELECTRONIC COMPONENTS AND MATERIALS Nov. 20 14 研究与试制 焊膏点涂工艺技术研究 许艳军，刘上朝，王晓莉 （北京新雷能科技股份有限公司，北京 100096） 摘要: 研究了焊膏材料特性、针头外形、点涂高度、滞留时间、回复高度、环境温度、针管内液面高度等对焊 膏点涂工艺的影响。结果表明：影响焊膏可点涂性的材料特性主要包括焊球粒度、焊膏黏度和合金体积比；在点涂 针头的选择上，尖锥形针头比常规直壁针管的针头更优；点涂高度对点涂焊膏量、点涂焊膏点的形貌、高度和直径 均有显著影响，其中点涂焊膏量随点涂高度的增加而增加，变化过程可分为完全堵塞阶段、快速增长阶段和相对稳 定阶段；此外，回复高度、环境温度、针管内液面高度均对焊膏点涂有显著影响，而滞留时间对焊膏点涂的影响不 明显。 关键词: 钎焊；点涂；焊膏；工艺稳定性；影响因素分析；材料特性 doi: 10.14106/ki.1001-2028.2014.11.024 中图分类号:TM277 文献标识码:A 文章编号:1001-2028 （20 14 ）11-0099-05 Dispensing process research of solder paste XU Yanjun, LIU Shangchao, WANG Xiaoli (Beijing Suplet Power Co., Ltd, Beijing 100096, China) Abstract: The effects of solder paste properties, nozzle shape, dispensing height, delay time, retracting height, ambient temperature and the level of material in the syringe on solder paste dispensing process were investigated. The results show that the material properties affecting the dispensability of solder paste include solder powder size, solder paste viscosity and the volume fraction of alloy. As for dispensing nozzle, the conical nozzle is better than the conventional straight-walled tip nozzle. The dispensing height has significant influence on dispensing mass, deposit shape, deposit height and deposit diameter, where the dispensing mass increases with increasing dispensing height, and the growth process can be divided into three stages: completely clogged stage, rapidly rising stage and relative steady stage. In addition, retracting height,