金属玻璃（非晶合金）制备技术-2.pptVIP

过冷液相区成型 吹模成型 吹模成型 吹模成型 吹模成型 热塑成型 Processing advantages of TPF of BMG BMG is the ideal material for small geometries since it is homogeneous even on the nano-scale. This is due to the fact that no “intrinsic” limitation, such as the grain size in crystalline materials is present. Since TPF is done isothermally and the subsequent cooling can be rather slow, thermal stresses can be reduced to a negligible level. Stresses or porosity resulting from solidi?cation shrinkage are also much smaller than in other metal processing methods. Solidi?cation shrinkage, in crystalline materials originates from both, thermal contraction and phase transition shrinkage. The latter accounts for about 5% in typical casting alloys. The absence of a ?rst order phase transition during solidi?cation of BMGs thus dramatically reduces solidi?cation shrinkage. As an example, Zr44Ti11Cu10Ni10Be25, with an approximate thermal expansion coef?cient of 5 × 10?6 K?1 experienced approximately 0.4% solidi?cation shrinkage during casting. During SPF of the same alloy the shrinkage is only 0.2%! The degree of porosity in the ?nal formed BMG depends on the porosity of the feedstock material which is typically less than 2%. Any existing porosity in the feedstock material is dramatically reduced (compressed) during TPF. If, for example, a feedstock material which contains 2% porosity with pores of 10 m or larger is formed under a pressure of 50 MPa, the porosity after TPF is reduced to 0.004%! 微成型及压印 微成型、压印 微米压印 微米压印 纳米压印 纳米压印 First, BMG1 is embossed on a mould fabricated by conventional techniques. The mould can be any suitable material such as Ni, Si or alumina, and an SEM image of a nickel mould used here is shown in a (note that only images are labelled a, b and so on). The mould and BMG1 are separated, leaving a negative pattern of the mould imprinted on BMG1. b, An example of pattern transfer on Pt-BMG after embossing on the Ni mould. The patterned BMG1 can b