aca互连的多因素作用研究与性能优化 word格式.docx

interconnection process. Various factors and interaction are analyzed by the parametric Finite Element Model using the methodology of design of experiments (DOE). The key factors’ effects on the quality are summarized. The conclusion is that higher pressure adds to the electrical performance; higher curing temperature and more rigid conductive adhesive and substrate help to achieve full contact among conductive particles, chips and the substrate, which however decrease the mechanical reliability in contrast; the height of chip bumps has little effect on both the electrical and mechanical performance. In the end, a quality index considering the mechanical reliability and electrical performance simultaneously is proposed, and rules of choosing parameters are indicated under various environments.The ACA interconnection process is optimized through a modified differential evolution (DE) method. Multi-objects optimization is performed, which chooses the electrical and mechanical performance of interconnection as sub-objects while the cure temperature, cure pressure, adhesive type, and substrate type as the optimization variables. During the optimization process, the surrogate model technology and DOE method are employed to cope with the high computational cost in the iterative calculations. The standard differential evolution (DE) method is modified to calculate the optimal results. The procedure for optimizing the parameters in ACA interconnection is proposed based on the agent model and modified DE method. Finally the conclusions are obtained that lower cure pressure, adhesive of low Young’s Modulus, and low rigid substrates can improve the mechanical reliability; and enhancing the cure pressure properly can lead to better combined performance considering both electrical and mechanical requirements. The application in the industry validates the conclusion.An integrated software tool is developed to analyze the ACA interconnection, which can help to calculate the deform