纳米填料和高导热高分子复合材料的制备及其性能研究-材料科学与工程;材料学专业论文.docx

ABSTRACTFor the aim of improving heat dissipation problem of micro-electronic components, guaranteeing the security and extending the serviced lives of components, it is crucial to develop the polymer composites with high thermal conductivity. As a rule, the high thermal conductivity polymer composites are fabricated by filling with the high thermal conductivity inorganic ceramic materials. However, a high content of filler materials can improve the thermal conductively but simultaneously can result in the poor mechanical properties and a high density of polymers. Therefore, the study of the