纳米填料和高导热高分子复合材料的制备及其性能研究-材料科学与工程;材料学专业论文.docx

ABSTRACTFor the aim of improving heat dissipation problem of micro-electronic components, guaranteeing the security and extending the serviced lives of components, it is crucial to develop the polymer composites with high thermal conductivity. As a rule, the high thermal conductivity polymer composites are fabricated by filling with the high thermal conductivity inorganic ceramic materials. However, a high content of filler materials can improve the thermal conductively but simultaneously can result in the poor mechanical properties and a high density of polymers. Therefore, the study of the thermal conductivity of polymer composites with excellent overall performance, such as light weight, appropriate mechanical properties and ease of processing, will be benefit to expand their application fields. In this paper, the new nano-fillers were prepared and then the effects of fillers type and filler systems on thermal conductivity, mechanical properties, electrical insulation, processing performance of composites were investigated. In addition, the effect of filler content on the heat conduction process of composites was also analyzed using finite element method.Firstly, the nano-AlN, AlN/CNTs and AlN/GE hybrid materials were prepared by simple urea method to be employed as new nano thermal conductive filler material and then were characterized by SEM, XRD, TEM, FTIR, TG and XPS. After that, these three types of nano-fillers were mixed with micro-Al2O3 at the same proportion to prepare the thermal conductive epoxy composite. Furthermore, the influence of three type nanoparticles on thermal conductivity, density and thermal stability of epoxy composites was investigated. The results revealed that the thermal conductivity of composite was significantly improved by adding nano-fillers. In addition, nano filler was also helpful to reduce the density and improve initial decomposition temperature and IPDT temperature of epoxy composites.Secondly, the Al2O3, AlN, BN, SiC, a