集成电路封装柱形铜凸点在耦合场中原子迁移的数值分析-numerical analysis of atom migration of cylindrical copper bumps in integrated circuit package in coupling field.docx

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集成电路封装柱形铜凸点在耦合场中原子迁移的数值分析-numerical analysis of atom migration of cylindrical copper bumps in integrated circuit package in coupling field.docx

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集成电路封装柱形铜凸点在耦合场中原子迁移的数值分析-numerical analysis of atom migration of cylindrical copper bumps in integrated circuit package in coupling field

ABSTRACTWithfurtherminiaturizationandharshserviceloading,solderjointofintegratedcircuit(IC)willsuffertheatomicmigration.Cu-PillarBumpsisanew,ultra-high-densityflip-chipinterconnectform,whichwillbecomethemainstreamnext-generationICpackagingtechnology.Thispaperaimstoinvestigateelectromigration,thermomigrationandstressmigrationofCu-PillarBumpsincoupledfieldviafieldtheory,kinetictheoryandviscoplasticthermalmechanicalanalysis.Throughfiniteelementmethodtoanalyzethespecificmodel,extractthekeyparametersofatommigration,thisworkinvestigatedthemechanismofatomicmigration.Atfirst,wewouldinvestigateelectromigration,thermomigrationstressmigrationofCu-PillarBumpsindividually.Thenweconductedacomprehensivestudyofthethreemigrationconditionsinamulti-fieldcouplingunderdifferentcurrents.TheICpackagesolderjointsisundercurrentstressingatmosttime.Weusedthefiniteelementmethodtosimulateaspecificmodelunderofdifferentcurrents.Bywhichwegotaclearpictureofitscurrentdistribution,anddrawthemaximumcurrentdensityandregionalvaluestoconfirmthesuspiciousandthepriorityplaceinwhichelectromigrationwilloccure.ItisshownthatelectromigrationresistanceofCu-PillarBumpsisimprovedbecausesolderisfarawayfromthecurrentblockingarea.Wecalculatedtheforcefromthermalgradient,thenfoundthattheforceduetothermalgradientcangreatlyaffecteelectromigration.Thermomigrationmustbeahiddenfailure.ICpackagesolderjointshavetofaceadifferenceoftemperatureinitsinner.Thisisduetothedifferenceofthethermalpropertiesandelectricalresistivityamongdidifferentmaterials.Inthispaper,wesimulatedaspecificmodelundertemperatureload.WeobtainedthetemperaturegradientandstressdistributioninCu-PillarBumps.Thetemperatureisveryimportantintheatomicmigration.Wesetthethechipat125℃,thenfoundthatthermalstressgradientcanbesignificanttomaketheatomicmigrationoccur.Also,theforceisbiggerthantheforcefromtemperaturegradient.Itindicatesthatundertemperatureload,stressmigrationcanoccurinthesolderjoints.Undercurrentstressing,Cu-PillarBumpssuffertheatomicmigrationincouplingfield