锡膏基础知识生产工艺及使用问题讲解(P77).pptVIP

PAD对焊接的影响: 60 70 80 90 100 Non Sn Plating Sn-Ag Plating Sn-Bi Plating Sn-Pb Plating Au Plating Pd Plating Non Sn Plating Sn-Ag Plating Sn-Bi Plating Sn-Pb Plating Cu 42-Alloy Test :Sn/Ag/Cu metal Spread Factor (%) 不同合金的不同外观: Sn/Pb Sn/3Ag/0.5Cu Sn/3.5Ag/0.7Cu/3Bi Sn/3.5Ag Sn/58Bi Sn/2Cu Sn/3Bi/8Zn Sn/3.5Ag/0.5Cu/8In 不同合金的熔点 曲线选取的其它因素: 确定温度曲线的要素： PCB 层结构/地线层等 PCB 尺寸/厚度/材料 PCB上元器件密度 焊盘材料类型 回流炉的类型 焊膏类型 元器件的温度敏感性 测试炉温的测点选择: 选择测试点时应考虑以下几点: 测试点的选择应尽量分散 大的地线焊盘 元器件密度 元器件材料 元器件尺寸 焊接夹具 热敏感元器件 颜色的选择( 适用于红外炉子) 锡膏的无铅进程 Japan 1997　Issued Recycle Initiative for Auto Mobile regulation 1998　Execution Disposal of Waste Matter regulation 2001 Execution Home Electronics Product Recycle regulation 2001　Execution Pollutant Release and Transfer Resister regulation USA 1999 NEMI Task Force 　　　　Recommend Sn/3.9Ag/0.6Cu EU Eco-label regulation draft for portable computer goods 2006　WEEE：Proposal for a directive on Waste from 　　　　 Electrical and Electronic Equipment (2004 = 2008 = 2006) 日系产商无铅化进程 Sanyo denki March 2002 Pb-free start(every company 1 model） TDK April 2002 all Pb-free Matsushita March 2003 all Pb-free Sony March 2005 all Pb-free NEC March 2005 all Pb-free Fujitsu End of 2002 all Pb-free Pioneer September 2002 Pb-free start Sharp March 2003 Pb-free start Mitsubishi March 2005 all Pb-free Hitachi March 2005 all Pb-free Toshiba March 2005 all Pb-free Automobile End of 2004 all Pb-free 无铅焊料合金成分与市场(一) Dip（Wave) Alloy Sn-3.0Ag-0.5Cu Sｎ-0.7Cu-Ni Sn-0.7Cu-Sb Market Public welfare Industry machine （Both sides PCB） Public welfare （One side PCB） Public welfare （One side PCB） Ratio 80 % 20 % 无铅焊料合金成分与市场(二) SMT（Reflow) Sn-Ag-Cu Sn-Ag-In Sn-Ag-Bi Sn-Zn-Bi Sn-3Ag-0.5Cu Sn-3.5Ag-0.75Cu Sn-3.5Ag-0.5Bi-8In Sn-3.5Ag-7In Sn-2.5Ag-0.5Cu-1.0Bi Sn-2.8Ag-0.5Cu-1.0Bi Sn-1.0Ag-57Bi Sn-1.0Ag-35Bi Sn-8 .0Zn - 3.0Bi Sn-7.0Zn-Al The whole company Special user Hand-held device P Company H Company S Company AUDIO MD V Company DVD S Company N Co