薄层液膜下pcb-cu的腐蚀行为及机理分析-corrosion behavior and mechanism analysis of pc b - cu under thin liquid film.docx

increase of RH, Cl- ion concentrations and temperature at large cathodic overpotential, respectively. At the initial stage, the corrosion rate of PCB-Cu increases with increasing of RH, Cl- ion concentrations and temperature, respectively. However, at the later stage, the corrosion products formed and accumulated on the electrode surface affect the corrosion process, resulting that the corrosion rate presents the different trends. In addition, the corrosion rates of PCB-Cu under different RH are higher than those in bulk solution.The effect of periodic wet and dry cycle on atmospheric corrosion behavior of PCB-Cu. The experimental results indicate that: The corrosion process of PCB-Cu in a single wet-dry cycle can be divided into three distinct regions. Region I is from the onset ofthe wet period to its end. RegionⅡis from the onset of the dry period until the stablepotential reaches. Region Ⅲ is the last stage of dry period. The process of electrochemical reaction transforms from the cathode process to the anode process. The corrosion rate of PCB-Cu decreases at the initial stage then increases slowly and eventually attains the steady value at the last exposure stage in the whole wet-dry cycle process of 122 h. Furthermore, the higher corrosion rate, the shorter the time of obtaining the steady state. The corrosion rate of PCB-Cu increases with increasing temperature and prolonging of the dry period, and the minimum corrosion rates are observed after exposure for 50 h. But in the presence of (NH4)2SO4, the corrosion rate of PCB-Cu shows increasing trend at the initial stage, and the minimum corrosion rates are observed after exposure for 74 h.The effect of the steady state electric field on atmospheric corrosion behavior of PCB-Cu. The experimental results indicate that: The cathodic polarization current and the corrosion rate of PCB-Cu decreases with increasing intensity of the steady state electric field. The corrosion rate of PCB-Cu in presence of the external e