纳米开关三维装配及测试的分析-analysis of three-dimensional assembly and testing of nano - switches.docxVIP

哈尔滨工业大学工学硕士学位论文 哈尔滨工业大学工学硕士学位论文 Abstract Sustained advances in nanotechnology have promoted the development of nanoelectronics from the laboratory stage to application fields such as biology, medicine and information technology. However, up to now, there are still no effective ways available for accurate manipulation and assembly of nanoelectronics. In this thesis, we proposed a nano-electronics fabrication method using a dual- probe nanotweezer and a typical nanoelectronics-nanoswitch is fabricated by nanomanipulation and three-dimensional nanoassembly. This method builds a link between the top-down fabrication and bottom-up fabrication techniques. The main objective of this study lies in fabricating nanowire nanoswitches, including microelectrode design, three-dimensional nanoassembly and testing of the nanoswitches. Firstly, charge distribution on the surface of the nanowire and the microelectrode are analyzed and thereby electrostatic forces between the nanowire and the microelectrode are calculated. Moreover, several key parameters which affect switching characteristics of the nanoswitch have been investigated. The nanoswitch structure is designed and then a process flow for microelectrode fabrication through photolithography. Secondly, interactive mechanism at the contact surface is analyzed and interactive forces between the nanotweezer and the nanowire are calculated. Then, nanoscale alignment between two probes is studied based on the atomic force microscopy force sensing and image scanning. Moreover, three-dimensional manipulation and assembly strategies based on the real-time force feedback are developed. In the next step, nanowires are accurately manipulated and assembled on the microelectrode to build a nanoswitch. Lastly, an electrical measurement has been carried out to obtain volt-ampere characteristics of the fabricated nanoswitch. And then more performance indicators, including the equivalent stiff