锡基cu核互连结构界面反应及其电迁移可靠性分析-interfacial reaction and electromigration reliability analysis of tin-based cu core interconnect structure.docxVIP

天津大学硕士学位论文 万方数据 The EM study on the Cu/Cu-cored Sn-3.5Ag-0.7Cu /Cu interconnect sample was below. On one hand, the Cu6Sn5 IMC layer at the anode solder/Cu wire interface became bilayer even multilayer structure with the EM time increasing, while that at the cathode solder/Cu core interface didn’t occur the above phenomenon. Since the thermal (Joule heating) effect induced by current density is inevitable during the EM process, the thermomigration (TM) will be induced. The direction of the TM at the anode side is along the electron flow direction, while that at the cathode side is opposite to the electron flow direction. As a result, the EM effect was strengthened and weakened by the TM at the anode side and cathode side, respectively. On the other hand, there appeared segregation and extrusions of Cu6Sn5 IMC on the interconnect sample surface, which presented different morphology on the anode-side and cathode-side surfaces, respectively. This was also related to the TM. KEY WORDS: Cu-cored solder interconnects, Interfacial reactions, Electromigration, intermetallic compounds III  目 录 中文摘要........................................................................................................................ I ABSTRACT ..................................................................................................................II 目 录......................................................................................................................... IV 第一章 前 言................................................................................................................1 1.1 锡基焊料合金研究现状 ...............................................................................1 Sn-Ag 系 1 Sn-Cu 系 3 Sn-Zn 系 3 Sn-Bi 系 4 Sn-In 系 4 1.2 锡基焊料合金互连结构的界面反应 ...........................................................5 1.3 锡基焊料合金互连结构的电迁移 ...............................................................7 1.3.1 电迁移的原子扩散模型 ................................................................