WLAN芯片在Ultraflex平台上测试解决方案分析-集成电路工程专业论文.docxVIP

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WLAN芯片在Ultraflex平台上测试解决方案分析-集成电路工程专业论文.docx

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WLAN芯片在Ultraflex平台上测试解决方案分析-集成电路工程专业论文

PAGE PAGE IV 目录 WLAN 芯片在 ULTRAFLEX 平台上测试解决方案研究············································I 摘要 ······························································································································I ABSTRACT ················································································································· II 第一章绪论 ················································································································· 7 1.1 课题的意义及国内外研究现状综述 ································································· 7 1.1.1 课题的来源·································································································· 7 1.1.2 课题研究的意义·························································································· 7 1.2 WLAN 芯片测试解决方案的现状 8 1.2.1 国外研究现状······························································································ 8 1.2.2 国内研究现状······························································································ 9 第二章研究对象-WLAN 芯片及其测试要求 ·························································· 11 2.1 WLAN 芯片和测试要求 ··················································································· 11 2.1.1 芯片的结构································································································ 11 2.1.2 测试要求和技术难点 ················································································ 12 2.2 本章小结 ·········································································································· 13 第三章整体解决预案································································································ 14 3.1 硬件设计与整合······························································································· 14 3.1.1 测试机台···································································································· 14 3.1.2 测试连接器············································································