苯并环丁烯碳硅烷聚合物的合成及性能研究-材料学专业论文.docxVIP

西南科技大学硕士研究生学位论文 第  PAGE 4 页 西南科技大学硕士研究生学位论文 第  PAGE 5 页 Abstract BCB have been considered as one of the most promising low-dielectric materials owing to their superior thermal, film-forming, low dissipation factor and low dielectric properties. However, BCB-based structures alone are difficult to meet the performance requirement of next-generation low-dielectric materials. Thus, it is needed to utilize the structure features of high performance polymers. In general, high performance polymers possess main-chain rigid or cross-linked structures. In this work, based on this rule, BCB units were introduced into the organosilicon polymers to synthesize a series of novel alternating copolymers containing BCB units. The thermal and dielectric properties of polymers and curing behavior were investigated systematically. In this work, a kind of benzocyclobutene/vinylphenyl-introduced polycarbosilanes (PVBCS) were synthesized by H2PtCl6 catalyzed ring-opening copolymerization of 4-(1-methylsilacyclobutyl) benzocyclobutene (4-MSCBBCB) and 1-methyl-1-(4-vinylphenyl) silacyclobutane (1-MVPSCB). By directly introducing photo-active groups on the pendants of polycarbosilanes, the PVBCS was endowed with photopatternability without additionally using any photo-initiators or photo-crosslinkers. DSC and FTIR characterization demonstrated that the PVBCS was UVthermally curable. The UV curing was conducted at ambient temperature and the thermally curing was performed above 200oC. TGA curves of the cured PVBCS indicated that the 5% weight loss temperature is 473oC, which is above the required temperature limit. The cured PVBCS also has low dielectric constant of 2.32-2.40 in the range of 1 k~1 MHz. The high temperature performance and low-dielectric constant could be attributed to the polycarbosilane main-chain structure and the benzocyclobutene-based cross-linked structure. A kind of benzocyclobutene-introduced polycarbosilane-block-polylactic acid diblock copolymer (PSB-b-PLA) wer