电子器件封装关键技术研究与双液灌封点胶机的研制-机械工程专业论文.docxVIP

E E ABSTRACT ηlis subje创 is a RD project which is on the basis of the market-oriented requests for electrical components embedment.It .calls us to ensure the systems technical target reach to the same level as well 部 congener products abroad. Therefore，the design of a feasible structure conforms to the integrate principle of mechanism ，electronics， pneumatology and rheology ，and a new-type mixing pouring and dispensing machine ofthe two different glues is developed successfully. It is primarily introduced the hardware composition and workf1ow of the machine， especially at the measuring and mixing system，detailed at the operating principle of gas and glues. Moreover，the selection of various components and the construction ofthe inner machine are discussed in this paper. The key technology and reliability of the machine design are also studied in this pap叽 which includes the measuring system with adjustable propo此ion，the pump clear羽nce of sealing without leakage，the static mixed system named SK model with the ability to be paused and cleaned wholly sel机propelled and 50 on. According to the cusωmer feedback，伽e system reached the expected technical index， with perfect performance and stable operation. Meanwhile ， ìts cost-performance ratio is al50 according with the actual situation in intemal electronics industry. Summing up the above，伽equipment is provided with high market potential and application value，can acquire favorable social value and economic benefits. ‘Keywords: the mixing pouring and dispensing machine of the two different glues， ‘ 4 measuring，mixing，pouring，dispensing 啕 目录 页数 第一章绪论 .… ……… 1 1.1 课题背景…………………………·…·………1 1.2 国内外的研究状况… .………………………….1 1.3 课题研究内容………… 2 第二章双液灌封点胶机的总体设计及封装材料选择……… .4 、2.1电子元器件封装型式和特点……… 4 、 2.2 电子元器件的封装材料…… .…5 2.3双液灌封点胶机的整体结构设计…… .8 2.4双液灌封点胶机的工作原理 .…………… 9 2.5 本章小结…… 111...…………15 第5章双液灌封点胶机计最技术的研究...……..川 16 3.1封装设备计最型式…… 16 3.2 活塞式计量泵…..……1 7 3.3活塞泵刚性介质密封间隙的研究……… ..20 3.4计量泵密封技术的研究 .…25 3.