锌镍合金用于超薄铜箔剥离层的研究-有色金属冶炼部分.DOCVIP

锌镍合金用于载体支撑超薄铜箔剥离层的研究 邓庚凤，黄崛起，赖远腾，徐鹏 （江西理工大学 冶金与化学工程学院，江西赣州 341000） 摘要：在35 μm载体铜箔上电镀一层高锌低镍合金镀层作为剥离层，再焦磷酸盐液电沉积超薄铜箔层，最后制得载体支撑超薄铜箔。考察了镀液硫酸锌和硫酸镍配比、焦磷酸钾络合剂及明胶添加剂等对剥离层性能的影响。结果表明在剥离层镀液中Zn2+Ni2+=4∶1，焦磷酸钾0.5 mol/L，明胶0.2 g/L十二烷基苯磺酸钠锌和镍能够共同沉积，镀层剥离层后剥离效果良好，载体箔和超薄铜箔间的剥离强度较稳定，可以达到4.7 N/cm。 关键词：锌镍合金；超薄铜箔；剥离层Study on Zn-Ni Alloy Used for Stripping Layer of Ultra-thin Copper Foil with Carrier Foil DENG Geng-feng, HUANG Jue-qi, LAI Yuan-teng, XU Peng (Metallurgical and Chemical Engineering Institute of Jiangxi University of Science and Technology, Ganzhou 341000, Jiangxi, China) Abstract：igh-zinc and low-nickel alloy coating used for stripping layer on 35 μm ultra-thin copper foil as carrier foil was electrodeposited. Ultra-thin copper foil was electrodeposited in pyrophosphate solution, and then ultra-thin copper carrier foil was prepared. The effects of ratio of zinc sulfate and nickel sulfate, dosage of complexing agent of potassium pyrophosphate trihydrate, dosage of additives of gelatin on the properties of stripping layer were investigated. The results show that zinc and nickel can be co-electroplated under the conditions including zinc sulfate of 12 g/L, nickel sulfate of 6 g/L, potassium pyrophosphate trihydrate of 0.5 mol/L, gelatin of 0.2 g/L and sodium dodecyl benzene sulfonate 0.2~0.3 g/L. Peelable strength between ultra-thin copper foil and carrier copper foil is stable and can reach 4.7 N/cm when zinc-nickel alloy is used as a stripping layer. Keywords: Zn-Ni alloy; ultra-thin copper foil; stripping layer 近年来，应用于PCB线路板及锂离子电池集流体等的铜箔向更薄的方向发展[1-3]。铜箔越薄，制备就更困难，而且在运输过程中很容易起皱和撕裂，因此制备工艺也高。目前，超薄铜箔的生产大多采用具有一定厚度的载体箔作为阴极，在其上电沉积铜。然后将镀上的超薄铜箔连同阴极的载体箔一热压，固化压制在绝缘材料板上，再将箔用化学或机械方法剥离除去。这种在载体上电沉积的超薄铜箔称为载体超薄铜箔。要实现载体支撑超薄铜箔的工业化生产，关键在于解决载体箔与超薄铜箔层的剥离问题[4]。目前多学者认为在载体箔和超薄铜箔层之间引进一层剥离层[5-7]，使得载体箔和超薄铜箔层易于分离。有使用有机剥离层[8]，剥离强度太小，会导致制备和使用复合箔过程中超薄铜箔从载体上部分或全部脱离有使用铬基层作为剥离层[9]，但金属铬本身有毒，对环境和人体有害。 本文焦磷酸盐体系制备载体支撑超薄铜箔。先让载体铜箔在焦磷酸盐体系中形成锌镍合金剥离层，再在该剥离层上以焦磷酸盐溶液电沉积超薄铜箔层，从而形成载体支撑超薄铜箔[10]。试验考察了剥离层制备工艺对载体支撑铜箔剥离性的影响，为获得稳定