高强度柔韧性室温固化环氧体系制备与性能研究-材料科学与工程专业论文.docxVIP

万方数据 II The The study of high strength flexible room temperature curing epoxy system Preparation and properties Abstract Epoxy adhesives are widely used into aerospace，automobile ships，machine building，chemical industry,electronic appliances and daily life，and other fields，with bonding，physical and mechanical，drug resistance and other good properties．But traditional curing epoxy is very brittle，limited its application，SO through various of methods to improve its flexibility,has became a research direction．Room temperature curing epoxy is the direction of the research，with easy operation，widely application range． This article uses the flexible polyamide 2766 and common polyamide 3 140 as curing agent for epoxy resin,gel time and DSC test results show that two kinds of low molecular weight polyamide cured epoxy system Can be room temperature curing；TGA results show that the thermal degradation degree of E-5 1／2766 system is associated with the quantity of low molecular weight polyamide 2766；DMTA results show that、丽廿l the increase of low molecular weight polyamide，system of tan delta is reduced，the glass transition temperature of E一5 1／3 140 system is higher than E·5 1／2766 system，and the glass transition temperature of the two kinds of system，with the increase of the content of low molecular weight polyamide，appears first increase and then reduce；Tensile properties test results show that the content of 2766 of E一5 1／2766 system to 80 phr has good tensile properties，the content of 3 140 of E一5 1／3 140 system to 70 phr tensile strength is maximum；Impact strength results show that the impact strength of E·5 1／2766 system is better than E一5 1／3 140． Introduced aliphatic epoxies into E-51／2766 and E一51／3140 epoxy systems，the influence of the viscosity of resin component，with the increase of the addition content of aliphatic epoxy,the viscosity of epoxy resin composition decrease exponentially,then found that long chain aliphatic epoxy resin for viscosity is higher tha