剪切蠕变下锡银焊点的电阻应变特性研究-凝聚态物理专业论文.docxVIP

中南大学硕士学位论文 中南大学硕士学位论文 ABSTIUCr ABSlRACT Creep behavior characteristic of Pb．free solder ioints iS a hotspot in the reliability issues．The dissertation performs systemic study on the electronic—resistance strains of Sn-3．5Ag solder joints shear creep with all in-situ micro electronic—resistance measurement。including four sections of modeling the mathematic relationship between equivalent cracks in solder joints and electronic—resistance strains，implementations of shear creep testing system， shear creep tests,and discussing the theory about electronic．resistance strains of solder joints creep，with some effective improvements．A mathematic model on the basic relationship between equivalent crack and electronic—resistance strains of solder joints is set up to series the base of theory,which is in view of the metal electric classical theory and Griffith’S theory of fracture．A software system based on Delphi and a hardware system based on MCS一5 1 series singlechip have been separately developed， with in-situ micro electronic·resistance measurement using four-probe techniques．The shear creep testing system consists of a software system and a hardware system．A lot of solder specimens’testing results have been processed using Origin software．111e correlative tables and graphs show that 1)the relationship between longest life and maximal electronic-resistance of solder joint is complex in the extreme，and it is necessary to study it further；2)the great mass of“electronic—resistance strains—time’’graphs Can show the continual development of crack／damage and fracture mechanisms which are consistent witIl results reported by literatures． and their stages of creep are shown clearly；3、however,a special phenomena-——粕ls firstly and climbs up latel弘——-can be found in some “electronic-resistance strains-time”graphs of Sn-3．5Ag solder joints which have small scale．At l