基于机器视觉的晶圆定位系统研究-机械电子工程专业论文.docxVIP

上海交通大学硕士学位论文 上海交通大学硕士学位论文 万方数据 万方数据 基于机器视觉的晶圆定位系统研究 摘 要 近年来，半导体行业制造工艺持续发展，微小芯片的市场需求也 急速增长，芯片尺寸、引线间距和焊盘直径不断减小，因而对封装设 备的运动精度要求越来越高。传统的封装设备已无法满足需要，视觉 定位技术已逐渐成为保证电子封装设备高精度运行的关键技术。本论 文研制了一套基于机器视觉的晶圆定位系统，实现芯片的实时定位与 对位操作。全文主要包括以下几个方面的内容： 一、针对晶圆定位系统的要求，对视觉系统和运动控制系统分别 进行具体的设计。 二、论文对机器视觉技术中重要的相机标定技术进行了一定的研 究，分析相机成像模型以及坐标转换关系。针对畸变小的远心镜头， 应用了一种线性模型，对视觉系统进行标定。 三、针对芯片特点，研究了定位算法。使用背景去除法进行图像 预处理，利用 Canny 算子进行边缘检测，提出利用边缘像素个数分离 各连通区域，同时提出基于霍夫变换和最小二乘法相结合的直线检测 算法进行直线检测，并利用直线检测结果计算图像中的定位点。最后 利用提取到的定位信息，计算出对位操作的运动量。 四、编写运动控制人机交互界面，将定位算法和运动控制系统结 合，实现晶圆定位系统的功能。 关键词：晶圆定位，定位算法，运动控制，机器视觉 I RESEACH ON THE POSITIONING SYSTEM OF WAFER BASED ON MACHINE VISION ABSTRACT With the progress of semiconductor manufacturing technology and burgeoning demand for tiny chips in the electronic market, the size of the chip has been decreasing as well as pad diameter and the distance between chip leads. The traditional encapsulation equipment has already been unable to meet the increasingly severe requirements. As a result, visual positioning technology gradually becomes key technology to guarantee the high precision of encapsulation equipment. A positioning system of wafer based on machine vision is described in this paper, which aims at the real-time location and alignment of the chip. The paper mainly includes following four parts. Visual system and motion control system were designed to meet the specific requirements of the positioning system of wafer. The paper done some research in the camera calibration technique. The imaging model was analysed in detail as well as the coordinate transforming relations. A linear model was applied to calibrate the visual system with telecentric lens Positioning algorithm was researched in this paper. In the algorithm, background subtraction method was used to finish image preprocessing, and then Canny operator was used to detect the edges in the image. The connected regions in the edge-extracted image, which corresponded to different positioning marks, were labeled accord