回收印刷电路板非金属粉增强聚氯乙烯发泡板材的配方研究-高分子化学与物理专业论文.docxVIP

回收印刷电路板非金属粉增强聚氯乙烯发泡板材的配方研究-高分子化学与物理专业论文.docx

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ABSTRACTIn ABSTRACT In this paper,We use recycling printed circuit board nonmetallic powder N—PCB as reinforcing agent and chlorinated polyethylene(CPE) as toughening agent,Azodicarbonamide(AC)as the foaming agent,to prepared high fin N—PCB/PVC foaming material.It provides a good experimental basis for solving the lightweight and high performance of N.PCB/PVC composites.Specific content includes: In order to prepared high filled N—PCB/PVC composites,We use the N..PCB powder as the reinforcing agent and CPE as the toughening agent. Research shows that with the increase in the amount of CPE,the flexural strength,flexural modulus and tensile strength of PVC composites decreased graduall5 and the impact strength and elongation at break increased.When the content of CPE was 20 phr,the flexural strength of the materials fell 22%,tensile strength decreased 23%,impact strength increased by 5 0%,elongation at break increased 3 6%.With the increase of PCB content,the impact strength and elongation at break of PVC composites decreased gradually,while the bending strength,bending modulus and tensile strength increased gradually,when adding 1 00 phr PCB the optimal mechanical properties have been found. The effects of additives and fillers on the decomposition temperature of AC foaming agent were studied.When the amount of AC is 1 phr,the Pb.Ba stabilizer quantity for 1 phr,the amount of n-pcb for 1 phr,the 万方数据 adding adding amount of epoxy resin E一44 O.1 phr,the composite foaming agent decomposition temperature was 1 66。C.On the basis of adding calcium based compound,when the added calcium based compound/AC composite foaming agent is 1 5/3.1,The sudden exothermic peak of the calcium based composite foaming agent is lost,and the DSC spectrum is transformed into an obvious endothermic peak.So calcium based composite foaming agent can solve the problem of PVC foaming material degradation which because of local severe heat release. High fill formulation of foam N—PCB/PVC c

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