环氧树脂基复合材料热界面(TIM)的分析-材料物理与化学专业论文.docxVIP

重庆大学 重庆大学硕士学位论文 英文摘要 PAGE PAGE IV ABSTRACT Heat generated by high-power LED chip can not dissipate effectively, it will affect the luminescence intensity and service life of high-power LED seriously. With the rapid development of low carbon economy, energy saving and emission reduction policy, the requiremnts for green lighting grows with each passing day. However, heat dissipation of high-power LED limits the wide applications of high-power LED in lighting field. Changes in the thermal conductivity of adhesive material may affect the temperature attribution of LED. Adhesive material can improve the heat dissipation of high-power LED effectively, once it have high thermal conductivity and adhesive strength、better insulation property and matched thermal expansion coefficient. Based on the analysis and summary of the current situation of thermal insulation adhesive materials, silane coupling agent and water bath heating method have been used to improve the surface of conductive powder and the substrate. Boron carbide/epoxy resin composites, silicon dioxide/epoxy resin composites and boron nitride/epoxy resin composites are prepared. These composites are characterized by OLYMPUS_BX53 optical microscope, scanning electron microscope (SEM), Fourier Transform infrared spectroscopy (FTIR), adhesive strength, thermal conductivity and dielectric constant. Layed the foundation of effective medium theory and Fourier conductive law, Pal model and Lewis-Nielsen model are used to calculate thermal conductivity of composites and to analyse the influence of van der waals interaction on thermal conductivity. Three-lyered composites with different adhesive composites have been prepared. The effects of surface treatment on three-layered composites have been characterized by thermal conductivity, adhesive strength, heat resistance and durability. The main conslusions obtained are as followed: ① During analysis on the influencing factors for thermal conductivity with Pal model and Le