光刻缺陷检查培训英文版.pptVIP

Visual Defect Introduction;XY05 Cross section (bipolar):;Layer Code;AC：Arcing ;BC / BV：Blind Contact / Blind VIA;BR ：bridge;C1：Tape residue;C2 ：Foreign contamination;CR ：corrosion;CK：Crack;C3：Si fragment;CO：contamination;DC：Dis-color;DM：Damaged （silicon damage）;HL：Hillock;HZ：Nitride haze;LD：local defocus;MA：mis-alignment ;NU：Non-uniform ;OE：over etch;PA：particle ;PA：particle ;PA：particle ;PA：particle ;PA：particle ;PB：PR burn;PI：Pits;PM：polymer;PC：Poor coating;PL：PR lifting;PR：PR remaining;PW：Powder ;RE：Residue (ETCH);RE：Residue (ETCH);RP：Residue (PHOTO);RD：repeating defect;RF：roughness;RF