焊球植球凸块工艺的可靠性研究.pdfVIP

、 Package, Test and Equipment doi:10.3969/j.issn.1003-353x.2010.12.012 1 2 肖启明, 汪辉 (1.上海交通大学微电子学院, 上海201203;2.中国科学院上海高等研究院, 上海201203) :焊球植球是一种最具潜力的低成本倒装芯片凸块制作工艺。采用焊球植球工艺制作的 晶圆级芯片尺寸 装芯片的凸块与芯片表面连接的可靠性问题是此类 装技术研究的重点。为 此, 参考JEDEC 关于电子 装相关标准, 建立了检验由焊球植球工艺生产的晶圆级芯片尺寸 装芯片凸块与芯片连接及凸块本身是否可靠的可靠性测试方法与判断标准。由焊球植球工艺生产 的晶圆级芯片尺寸 装芯片, 分别采用高温存储、 热循环和多次回流进行试验, 然后利用扫描电 子显微镜检查芯片上凸块剖面的凸块下金属层分布和测试凸块推力大小来验证凸块的可靠性。试 验数据表明焊球植球工艺生产的晶圆级芯片尺寸 装芯片具有高的 装连接可靠性。 :晶圆级芯片尺寸 装;焊球植球;高温存储;热循环;多次回流。 :TN305.94 　　:A 　　:1003-353X (2010)12-1190-04 Reliability Research of Solder Ball Placement Bumping Process 1 2 Xiao Qiming , Wang Hui (1.College of microelectronics, Shanghai J iaotong University, Shanghai 201203, China; 2.Shanghai Advanced Research Institute, CAS, Shanghai 201203, China) Abstract:The solder alls placement technology is the most potential low cost flip chip umping method for umps manufacture.The connection relia ility of the umps to the chip is the most important research aspect of the package technology.According to the reference of the relevant JEDEC standards for electronic assem ly, the relia ility test method and judgment criteria for the umpswere uilt up, which can detect the umps and the connection etween the chip and the umps made y solder alls placement technology for the wafer level chip scale package.For the wafers made y solder alls placement technology, the high temperature storage, thermal circling and multi reflow test were used.The metallurgy distri ution of the ump underlayer at the ump cross-section on the chip was checked y SEM and the ump process relia ility was verified y measuring the shear force to the umps.The tes