喷射沉积70_Si_Al合金电子封装材料的组织与性能.pdfVIP

第 19卷第 2 期 中国有色金属学报 2009 年 2 月 Vol.19 No.2 The Chinese Journal of Nonferrous Metals Feb. 2009 文章编号：1004-0609 2009 02-0303-05 喷射沉积 70%Si-Al 合金电子封装材料的组织与性能 李 超，彭超群，余 琨，王日初，杨 军，刘 溶 中南大学 材料科学与工程学院，长沙 410083 摘 要：采用喷射沉积与热压相结合的方法制备电子封装用 70%Si-Al 合金坯料，采用扫描电镜和金相显微镜观 察合金的显微组织。结果表明：采用喷射沉积与热压相结合的方法可获得直径为 76.2 mm、厚度为6 mm 的70%Si-Al 合金样品；合金中初晶 Si 的长大受到抑制，初晶Si 相的尺寸仅为 20~50 μm，分布均匀且形成连续骨架；Al 相围 绕 Si 相间隙呈连续网络分布，这种结构有利于提高材料热导率，降低其线膨胀系数；通过与后续热压相结合制备 ?6/K 。 的 70%Si-Al 合金样品，其室温热导率达到 110 W/ m·K ，400 ℃时线膨胀系数仅为 9.6 ×10 关键词：70%Si-Al 合金；电子封装；热导率；喷射沉积 中图分类号：TB 331 文献标识码：A Microstructure and properties of spray deposition 70%Si-Al alloy for electronic packaging applications LI Chao, PENG Chao-qun, YU Kun, WANG Ri-chu, YANG Jun, LIU Rong School of Materials Science and Engineering, Central South University, Changsha 410083, China Abstract: 70%Si-Al alloy was prepared by spray deposition and hot pressing technology. The microstructures of the alloy were investigated by scanning electron microscopy and metallographic microscopy. The results show that by spray deposition and hot pressing technology 70%Si-Al alloy with a diameter of 76.2 mm and a thickness of 6 mm can be obtained. The growth of primary silicon in 70%Si-Al alloy can be inhibited, and its grain size is only 20~50 μm. The distribution of primary silicon forms a continuous framework and the Al phase encircles the interval of Si phase continuously. The increase