插头镀金线镀层厚度计算模型的研究.pdfVIP

表面处理与涂覆 Surface Treatment and Coating 印制电路信息 2013 No.4 插头镀金线镀层厚度计算模型研究 Paper Code: S-084 高来华 陈海燕 （深南电路有限公司，广东 深圳 518053） 摘 要 电镀镍金镀层厚度是PCB产品可靠性的关键指标，文章从插头镀金线实际生产需求 出发，运用法拉第定律和多元函数进行数学推导，得出一个普遍适用于插头镀金线镀 层厚度理论计算模型。在理论计算模型的基础上进行多次试验分别得出电镀镍和电镀 金的电流效率，并对实际镀层厚度计算模型的有效性进行重复试验验证。试验结果表 明，我们可以得出一个合理的镀层厚度计算模型以指导插头镀金线实际生产。 关键词 电镀镍金；插头镀金；镀层厚度；计算模型；电流效率 中图分类号：TN41 文献标识码：A 文章编号：1009-0096（2014）04-0050-05 Study on calculational model for the electrodeposited coatings thickness of nickel and gold about plug gold plating line GAO Lai-hua CHEN Hai-yan Abstract The electrodeposited coatings thickness of Nickel and Gold is the crucial quality index for PCB manufacture reliability. The paper makes use of Faraday Law and function of many variables to deduce an applicable theoretical calculational model for the electrodeposited coatings thickness of Nickel and Gold about Plug Gold plating line. We carried out so many experiments based on the theoretical calculational model that the current efficiencies about electroplating Nickel and Gold are worked out. We verified the effectiveness of the actual calculational model by repeated experiments. The results shows that we can get a logical calculational model to the electrodeposited coatings thickness for Plug Gold plating line in practice. Key words Electroplating Nickel and Gold; Plug Gold Plating; Electrodeposited Coatings Thickness; Calculational Model; Current Efficiencies 1 前言